Engineering

Engineering

ISSN Print: 1947-3931
ISSN Online: 1947-394X
www.scirp.org/journal/eng
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"A New Model for the Etching Characteristics of Corners Formed by Si{111} Planes on Si{110} Wafer Surface"
written by Prem Pal, Sajal Sagar Singh,
published by Engineering, Vol.5 No.11A, 2013
has been cited by the following article(s):
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[1] High speed silicon wet anisotropic etching for applications in bulk micromachining: a review
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[2] Silicon field emitters fabricated by dicing-saw and wet-chemical-etching
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[3] Electron Diagnostics for Extreme High Brightness Nano-Blade Field Emission Cathodes
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[4] Aging Effects of KOH+ NH2OH Solution on the Etching Characteristics of Silicon
2019
[5] Effective improvement in the etching characteristics of Si {110} in low concentration TMAH solution
Micro & Nano Letters, 2018
[6] Microstructures with Protected Convex Corners in Modified KOH Solution Exhibiting High-Speed Silicon Etching
2018
[7] Silicon wet bulk micromachining for MEMS
2017
[8] Etching characteristics of Si {110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS
Micro and Nano Systems Letters, 2017
[9] High Speed Surface Illuminated Si Photodiode Using Microstructured Holes for Absorption Enhancements at 900–1000 nm Wavelength
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[10] Effect of NH2OH on Etching Characteristics of Si {100} in KOH Solution
2017
[11] Silicon-on-sapphire (SOS) waveguide modal analysis for mid-infrared applications
Journal of Physics Communications, 2017
[12] A measurement free pre-etched pattern to identify the< 110> directions on Si {110} wafer
Microsystem Technologies, 2016
[13] Determination of precise crystallographic directions for mask alignment in wet bulk micromachining for MEMS
Micro and Nano Systems Letters, 2016
[14] Fabrication of silicon nanowires with controlled nano-scale shapes using wet anisotropic etching
2015
[15] A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching
Micro and Nano Systems Letters, 2015
[16] A detailed investigation and explanation of the appearance of different undercut profiles in KOH and TMAH
Journal of Micromechanics and Microengineering, 2014
[17] Anisotropic etching on Si {1 1 0}: experiment and simulation for the formation of microstructures with convex corners
Journal of Micromechanics and Microengineering, 2014
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