"Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly"
written by C. F. Lin, G. H. Wu, S. H. Ju,
published by Journal of Electronics Cooling and Thermal Control, Vol.3 No.3, 2013
has been cited by the following article(s):
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[1] Thermal decomposition of solder flux activators under simulated wave soldering conditions
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[2] Study of enhanced plastic ball grid array (EPBGA) package with heat spreader of copper plane
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, 2015