Microstructure Evolution of W-Cu Alloy Wire

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Materials Sciences and Applications

ISSN Print: 2153-117X
ISSN Online: 2153-1188
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"Microstructure Evolution of W-Cu Alloy Wire"
written by Fei Shao, Wenge Chen, Hui Zhang, Bingjun Ding,
published by Materials Sciences and Applications, Vol.3 No.3, 2012

has been cited by the following article(s):

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[1]	Effect of pH on the corrosion behavior of tungsten-copper alloys
	2020

[2]	Design and Implementation of Solid/Solid Phononic Crystal Structures in Lateral Extensional Thin-film Piezoelectric on Silicon Micromechanical Resonators
	2020

[3]	Preparation of w–cu nano-composite powders with high copper content using a chemical co-deposition technique
	Advanced Powder Technology, 2018

[4]	High-temperature compression behavior of W–10wt.% Cu composite
	International Journal of Refractory Metals and Hard Materials, 2015

[5]	High-temperature compression behavior of W–10 wt.% Cu composite
	International Journal of Refractory Metals and Hard Materials, 2015

[6]	Influence of Mandrel on the Performance of Titanium Tube in Cold Rotary Swaging
	Materials and Manufacturing Processes, 2014

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