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Materials Sciences and Applications
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Materials Sciences and Applications
ISSN Print:
2153-117X
ISSN Online:
2153-1188
www.scirp.org/journal/msa
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msa@scirp.org
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"
Microstructure Evolution of W-Cu Alloy Wire
"
written by
Fei Shao, Wenge Chen, Hui Zhang, Bingjun Ding
,
published by
Materials Sciences and Applications
,
Vol.3 No.3, 2012
has been cited by the following article(s):
Google Scholar
CrossRef
[1]
Effect of pH on the corrosion behavior of tungsten-copper alloys
2020
[2]
Design and Implementation of Solid/Solid Phononic Crystal Structures in Lateral Extensional Thin-film Piezoelectric on Silicon Micromechanical Resonators
2020
[3]
Preparation of w–cu nano-composite powders with high copper content using a chemical co-deposition technique
Advanced Powder Technology
,
2018
[4]
High-temperature compression behavior of W–10wt.% Cu composite
International Journal of Refractory Metals and Hard Materials
,
2015
[5]
High-temperature compression behavior of W–10 wt.% Cu composite
International Journal of Refractory Metals and Hard Materials
,
2015
[6]
Influence of Mandrel on the Performance of Titanium Tube in Cold Rotary Swaging
Materials and Manufacturing Processes
,
2014
[1]
Influence of Mandrel on the Performance of Titanium Tube with Cold Rotary Swaging
Materials and Manufacturing Processes
,
2015
DOI:
10.1080/10426914.2014.984205
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