Thermal Behavior of Clay-Based Building Materials: A Numerical Study Using Microstructural Modeling

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ISSN Print: 2327-588X
ISSN Online: 2327-5901
www.scirp.org/journal/jpee
E-mail: jpee@scirp.org

"Thermal Behavior of Clay-Based Building Materials: A Numerical Study Using Microstructural Modeling"
written by Ahmed Lkouen, Mohamed Lamrani, Ahmed Meskini, Abdelhamid Khabbazi,
published by Journal of Power and Energy Engineering, Vol.10 No.4, 2022

has been cited by the following article(s):

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[1]	Thermal performance and energy efficiency of the composite clay and hemp fibers Journal of Building Engineering, 2023 DOI:10.1016/j.jobe.2023.106810

[2]	Numerical study of thermal stress of a building material based on clay and date palm fibers Materials Today: Proceedings, 2023 DOI:10.1016/j.matpr.2023.07.104

[3]	Thermal performance and energy efficiency of the composite clay and hemp fibers Journal of Building Engineering, 2023 DOI:10.1016/j.jobe.2023.106810

[4]	Investigation of Thermal behaviour of Insulating Building Walls with Clay-Based Panels: A Case Study in Southeast Morocco E3S Web of Conferences, 2023 DOI:10.1051/e3sconf/202346900004

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