"
Formation of Copper Nickel Bimetallic Nanoalloy Film Using Precursor Inks"
written by Chaitanya G. Mahajan, Amanda Marotta, Bruce E. Kahn, Mark Irving, Surendra Gupta, Richard Hailstone, Scott A. Williams, Denis Cormier,
published by
Materials Sciences and Applications,
Vol.10 No.4, 2019
has been cited by the following article(s):
[1]
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Particle-less reactive inks
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SMART MULTIFUNCTIONAL NANO …,
2023 |
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[2]
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Molybdenum and Tungsten Metal Organic Decomposition Complex Synthesis and Characterization
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2022 |
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[3]
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Magnetite incorporated amine-functional SiO2 support for bimetallic Cu-Ni alloy nanoparticles produced highly effective nanocatalyst
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Colloids and Surfaces A …,
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[4]
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Amine functional silica–supported bimetallic Cu-Ni nanocatalyst and investigation of some typical reductions of aromatic nitro-substituents
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Colloid and Polymer …,
2022 |
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[5]
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Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics
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… Applied Materials & …,
2022 |
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[6]
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Intergranular Diffusion‐Assisted Liquid‐Phase Chemical Vapor Deposition for Wafer‐Scale Synthesis of Patternable 2D Semiconductors
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Advanced Functional …,
2022 |
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[7]
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Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials
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ACS Applied Electronic …,
2022 |
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[8]
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Nickel-based inks for flexible electronics—a review on recent trends
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Journal of Advanced …,
2022 |
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[9]
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Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures
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2021 |
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[10]
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Nickel-Based Inks for Inkjet Printing: A Review on Latest Trends
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2021 |
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[1]
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Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics
ACS Applied Materials & Interfaces,
2022
DOI:10.1021/acsami.1c21633
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[2]
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Amine functional silica–supported bimetallic Cu-Ni nanocatalyst and investigation of some typical reductions of aromatic nitro-substituents
Colloid and Polymer Science,
2022
DOI:10.1007/s00396-021-04910-w
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[3]
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Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials
ACS Applied Electronic Materials,
2022
DOI:10.1021/acsaelm.2c01150
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[4]
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Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials
ACS Applied Electronic Materials,
2022
DOI:10.1021/acsaelm.2c01150
|
|
|
[5]
|
Self-Organizing, Environmentally Stable, and Low-Cost Copper–Nickel Complex Inks for Printed Flexible Electronics
ACS Applied Materials & Interfaces,
2022
DOI:10.1021/acsami.1c21633
|
|
|
[6]
|
Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures
ACS Applied Materials & Interfaces,
2021
DOI:10.1021/acsami.1c04235
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[7]
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Highly Conductive, Flexible, and Oxidation-Resistant Cu-Ni Electrodes Produced from Hybrid Inks at Low Temperatures
ACS Applied Materials & Interfaces,
2021
DOI:10.1021/acsami.1c04235
|
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