Fabrication, Microstructure, Thermal and Electrical Properties of Copper Heat Sink Composites

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ISSN Print: 2153-117X
ISSN Online: 2153-1188
www.scirp.org/journal/msa
E-mail: msa@scirp.org

"Fabrication, Microstructure, Thermal and Electrical Properties of Copper Heat Sink Composites"
written by Walid Daoush, Ahmed Swidan, Gamal Abd El-Aziz, Mohamed Abdelhalim,
published by Materials Sciences and Applications, Vol.7 No.9, 2016

has been cited by the following article(s):

[1]	Understanding and designing metal matrix nanocomposites with high electrical conductivity: A review
	Journal of Materials Science, 2022

[2]	Thermal and Mechanical Properties of Epoxy Resin Functionalized Copper and Graphene Hybrids using In-situ Polymerization Method
	2021

[3]	An Equivalent Heat Transfer Model Instead of Wind Speed Measuring for Dynamic Thermal Rating of Transmission Lines
	2020

[4]	Wiedemann-Franz law of Cu-coated carbon fiber
	2020

[5]	Microstructure and electrical properties of carbon short fiber reinforced copper composites fabricated by electroless deposition followed by powder metallurgy process
	2019

[6]	Microstructure and properties of BN/Ni-Cu composites fabricated by powder technology
	Journal of Experimental Nanoscience, 2018

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