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Materials Sciences and Applications
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Materials Sciences and Applications
ISSN Print:
2153-117X
ISSN Online:
2153-1188
www.scirp.org/journal/msa
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"
EBSD Analysis of the Submicron Width Fibber Shaped Grain Copper Fabricated by Drawing
"
written by
Masafumi Matsushita, Tomoya Kuji, Hiromitsu Kuroda, Seigi Aoyama, Hiroaki Ohfuji
,
published by
Materials Sciences and Applications
,
Vol.2 No.7, 2011
has been cited by the following article(s):
Google Scholar
CrossRef
[1]
Investigations on the Aging of Traction Conductors Using Morphological and Textural Analysis
Proceedings of Symposium …
,
2021
[2]
Effects of Different Wire Drawing Routes on Grain Boundary Character Distribution, Microtexture, δ-Phase Precipitation, Grain Size and Room Temperature …
2020
[3]
Structure and Mechanical Properties of Electrical Copper Wire Processed by Coarse and Medium Drawing
2019
[4]
Fiber vs Rolling Texture: Stress State Dependence for Cold-Drawn Wire
Metallurgical and Materials Transactions A
,
2018
[5]
Relationship Between Deformation and Recrystallization Texture in Copper Wire.
Materials Science Forum
,
2017
[6]
Partial Melting, Segregation Behavior and Nanomechanical Properties of AlCu2Si1Mg0. 6 Alloy
Materials Science Forum
,
2017
[7]
Relationship between Deformation and Recrystallization Texture in Copper Wire
2017
[8]
ТЕКСТУРА ВОЛОЧЕНИЯ МЕДНОЙ ПРОВОЛОКИ
2016
[9]
Calculation of the strain state under multipass wire drawing
2016
[10]
Взаимосвязь напряженно-деформированного состояния и текстуры волочения в ГЦК-металлах
2016
[11]
Закономерности изменения текстуры по радиусу электротехнической медной проволоки в процессе волочения
2015
[1]
Structure and Mechanical Properties of Electrical Copper Wire Processed by Coarse and Medium Drawing
Materials Science Forum
,
2019
DOI:
10.4028/www.scientific.net/MSF.946.845
[2]
Relationship between Deformation and Recrystallization Texture in Copper Wire
Materials Science Forum
,
2017
DOI:
10.4028/www.scientific.net/MSF.907.173
[3]
Calculation of the strain state under multipass wire drawing
2016
DOI:
10.1063/1.4967089
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