"Emerging Business Trends in the Microelectronics Industry"
written by Samar K. Saha,
published by Open Journal of Business and Management, Vol.4 No.1, 2016
has been cited by the following article(s):
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[2] FinFET Devices for VLSI Circuits and Systems
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[3] A Study of Die Shear Test Performance on Different Diebond Machine Platforms
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[4] Leadframe Design Enhancement for Elimination of Burrs at Singulation Process
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[5] Ball Misplace Mitigation through Process Optimization of Advanced Leadframe Package
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[6] Elimination of Smashed Ball Defect through Process and Design Improvement
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[7] Die Attach Machine Selection for Glue Voids Reduction Performance
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[8] Die Attach Film Bleed out Resolution through Process Optimization on DFN Packages
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[9] Process Optimization to Eliminate Automatic Alignment Failures on the Scalable Device
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[10] Addressing Package Voids on Extremely Small Leadframe Device
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[11] Resolution of Damaged Metallization on Highly Complex Semiconductor Device
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[12] The poetics of one's testimony
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[13] Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling
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[14] Pick and Place Process Defect Mitigation on Semiconductor BGA Device
2020
[15] Transitioning Semiconductor Companies Enabling Smart Environments and Integrated Ecosystems
2018
[16] Advances in Business and Management
2018
[17] Fabless Semiconductor Firms' Financial Performance Determinant Factors: Product Platform Efficiency and Technological Capability
2018
[18] Circuit Obfuscation and Oracle-guided Attacks: Who can Prevail?
GLSVLSI 2017 Proceedings of the on Great Lakes Symposium on VLSI 2017, 2017
[19] Cost-Benefit Analysis of Computer-Aided Technology Customization Projects
2017
[20] Nanotechnology for Microelectronics and Photonics
2017
[21] CYBER SUPPLY CHAIN SECURITY: CAN THE BACKDOOR BE CLOSED WITH TRUSTED DESIGN, MANUFACTURING AND SUPPLY
2016