"Structure and Properties of Sn-9Zn Lead-Free Solder Alloy with Heat Treatment"
written by Mahmoud Hammam, Fardos Saad Allah, El Said Gouda, Yaser El Gendy, Heba Abdel Aziz,
published by Engineering, Vol.2 No.3, 2010
has been cited by the following article(s):
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[1] Enhanced microstructural, thermal and tensile characteristics of heat treated Sn-5.0 Sb-0.3 Cu (SSC-503) Pb-free solder alloy under high pressure
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[2] Microstructure and mechanical properties of tin-based alloys for miniature detonating cords
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[3] Effect of Bi on the microstructure and mechanical properties of Sn-Zn alloys processed by rolling
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[4] The effect of the solidification rate on the physical properties of the Sn-Zn eutectic alloy
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[5] Microstructural and mechanical characterization of melt spun process Sn-3.5 Ag and Sn-3.5 Ag-xCu lead-free solders for low cost electronic assembly
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[6] Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders.
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[7] Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders
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[8] Ag katkılı Sn-ağ.% 8.8 Zn ötektik alaşımının doğrusal katılaştırılması ve fiziksel özelliklerinin incelenmesi
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[9] Structure and Properties of the Al-Sn-Cu Bearing Alloy under Different Cold Rolling Conditions
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[10] Structure and properties of the Al—Sn—Cu bearing alloy under different cold rolling conditions
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[11] Structure and mechanical properties of rapidly quenched Al–5% Mg alloy after heat treatment
Metal Science and Heat Treatment, Springer, 2012
[12] Effect of Ag-content on structure, corrosion behaviour and mechanical properties of Sn-9Zn lead-free solder alloy
The European Physical Journal Applied Physics?, 2010