Author(s)

Jivaan Kishore Jhothiraman, Rajesh Balachandran^*

Micron Technology Inc., Boise, USA.

There is a lot of research that has been done on electroplating of metals depending on the type of application. In this chapter, the importance of this technique to the semiconductor industry is discussed in detail from an experimental as well as a modeling standpoint. In particular, the effect of solution variables i.e. chloride, accelerator, suppressor on copper electrodeposition is discussed. This knowledge is applied to achieve a defect-free, bottom-up metal/copper fill that eventually, is one of the most critical processes in this billion-dollar industry.

Electroplating, Copper, Interconnects, Modeling

Jhothiraman, J. and Balachandran, R. (2019) Electroplating: Applications in the Semiconductor Industry. Advances in Chemical Engineering and Science, 9, 239-261. doi: 10.4236/aces.2019.92018.