Author(s)

Qian Lin¹, Haifeng Wu², Guoqing Jia¹

¹College of Physics and Electronic Information Engineer, Qinghai University for Nationalities, Qinghai, China.
²Chengdu Ganide Technology, Chengdu, China.

Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs’ interconnect reliability and help the new entrants to understand the present situation of this area.

Integrated Circuit, Interconnect Reliability, Interconnect Modeling, Interconnect Process

Lin, Q. , Wu, H. and Jia, G. (2018) Review of the Global Trend of Interconnect Reliability for Integrated Circuit. Circuits and Systems, 9, 9-21. doi: 10.4236/cs.2018.92002.