Author(s)

Anandan Malaiarasan¹, Dr. Suresh Kumar Natarajan², Rajeswari Packianathan², Gobinath Arumugam²

¹1Department of Electronics and Communication Engineering, Latha Mathavan Engineering College, Madurai, India.
²Department of Electronics and Communication Engineering, Velammal College of Engineering and Technology, Madurai, India.

As per the entail in wireless communication, the ever increasing switching speeds of digital devices pose significant challenges. Signal quality is more important for high speed products and the signal integrity must ensure reliable transmission where signal integrity is a measure of the quality of an electrical signal. A high speed differential signal will result in signal integrity issues such as crosstalk and radiated emission. One of the solutions to suppress radiated emission is defected ground pattern. This paper introduces a novel trident incurvature shaped defected ground structure to suppress radiated emission that arises in high speed differential signal. The proposed defected ground structure is implemented using Ansoft HFSS simulation tool and its performance is quantified in terms of scattering parameters. The proposed trident incurvature shaped defected ground pattern reduces near end coupling and far end coupling by more than 6 dB and 2 dB respectively. It also provides better return loss and insertion loss in the frequency range 1 - 6 GHz.

Radiated Emission, Near End Crosstalk, Far End Crosstalk, Return Loss, Insertion Loss, Defected Ground Structure

Malaiarasan, A. , Natarajan, D. , Packianathan, R. and Arumugam, G. (2016) A Novel Trident Incurvature Shape DGS to Suppress Radiated Emission in High Speed Printed Circuit Board. Circuits and Systems, 7, 3026-3037. doi: 10.4236/cs.2016.710258.