Author(s)

Mahdi Keikhaie^1*, Nasser Keikhaie², Reza Keikhaie¹, Mohammad Mahdi Kaykha³

¹Department of Mechanical Engineering, Sharif University of Technology, Tehran, Iran.
²Department of Mechanical Engineering, University of Sistan and Baluchestan, Zahedan, Iran.
³Department of Mechanical Engineering, University of Zabol, Zabol, Iran.

Thin bonded films have many applications (i.e. in information storage and processing systems, and etc.). In many cases, thin bonded films are in a state of residual tension, which can lead to film cracking and crack extension in one layer often accompanies failure in whole systems. In this paper, we analyze a channel crack advanced throughout thickness of an elastic thin film bonded to a dissimilar semi-infinite substrate material via finite element method (FEM). In order to simplify modeling, the problem is idealized as plane strain and a two-dimensional model of a film bonded to an elastic substrate is proposed for simulating channel crack in thin elastic film. Film is modeled by common 4-node and substrate by infinite 4-node meshes. The stress intensity factor (SIF) for cracked thin film has been obtained as a function of elastic mismatch between the substrate and the film. The results indicate that in elastic mismatch state, SIF is more than match state. On the other hand, mismatch state is more sensitive to crack than match state. And SIF has also increased by increasing Young’s modulus and Poisson ratio of film.

Thin Film, Channeling Crack, Infinite Element, SIF

Keikhaie, M. , Keikhaie, N. , Keikhaie, R. and Kaykha, M. (2015) Stress Intensity Factors in Two Bonded Elastic Layers Containing Crack Perpendicular on the Interface with Different Elastic Properties. Journal of Modern Physics, 6, 640-647. doi: 10.4236/jmp.2015.65070.