Advances in Materials Physics and Chemistry

Advances in Materials Physics and Chemistry

ISSN Print: 2162-531X
ISSN Online: 2162-5328
www.scirp.org/journal/ampc
E-mail: ampc@scirp.org

Call For Papers

Special Issue on Thin Film Materials and Its Applications


Thin films are important because they offer the potential for low-cost processing with minimal material usage while fulfilling application requirements. Importantly, this can enable cost-effective applications for expensive raw source materials. Thin films also can enable applications where low weight and mechanical flexibility are crucial. The goal of this special issue is to provide a platform for scientists and academicians all over the world to promote, share, and discuss various new issues and developments in the area of thin film materials and its applications.


In this special issue, we intend to invite front-line researchers and authors to submit original research and review articles on exploring thin film materials and its applications. Potential topics include, but are not limited to:



  • Film deposition methods
  • Ceramic thin films
  • Structural control of compound thin films
  • Modes of film growth by vapor deposition
  • Film microstructures
  • Processing of microelectronic structures
  • Film stress and substrate curvature
  • Thin Film materials and devices
  • Thin film processes
  • Thin films as material engineering



Authors should read over the journal’s For Authors carefully before submission. Prospective authors should submit an electronic copy of their complete manuscript through the journal’s Paper Submission System.


Please kindly specify the “Special Issue” under your manuscript title. The research field “Special Issue - Thin Film Materials and Its Applications” should be selected during your submission.


Special Issue Timetable:


Submission Deadline

August 30th, 2021

Publication Date

October 2021


Guest Editor:


For further questions or inquiries,

please contact Editorial Assistant at

ampc@scirp.org.

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