Call For Papers

    Special Issue on

    Material Microstructure, Properties and Applications

    The early materials used by humans were natural, and their structure varied widely. Rocks are crystalline, pottery is a mixture of glassy and crystalline components, wood is a fibrous organic material with a cellular structure, and leather is a complex organic material. The successful utilization of materials requires that they satisfy a set of properties. These properties can be classified into thermal, optical, mechanical, physical, chemical, and nuclear, and they are intimately connected to the structure of materials. The structure, in its turn, is the result of synthesis and processing. The goal of this special issue is to provide a platform for scientists and academicians all over the world to promote, share, and discuss various new issues and developments in the area of material microstructure, properties and applications.

    In this special issue, we invite front-line researchers and authors to submit original research and review articles that explore material microstructure, properties and applications. In this special issue, potential topics include, but are not limited to:

    • Atomic and electronic structure of the material
    • The crystal structure of materials
    • The mechanical properties of the materials
    • Physical properties of the materials
    • Chemical properties of the materials
    • Microstructural characterization
    • The structure and characterization of materials

    Authors should read over the journal’s For Authors carefully before submission. Prospective authors should submit an electronic copy of their complete manuscript through the journal’s Paper Submission System.

    Please kindly specify the Special Issue” under your manuscript title. The research field “Special Issue - Material Microstructure, Properties and Applications” should be selected during your submission.

    Special Issue timetable:

    Submission Deadline

    January 30th 2021

    Publication Date

    March 2021

    Guest Editor:

    For further questions or inquiries

    Please contact Editorial Assistant at