Call For Papers

    Special Issue on 

    Low-Power Design for Sensor Interface and Integrated Circuit

    The rapid growth of the consumer electronics for battery-powered devices has made the low-power sensor interface and integrated circuits a burgeoning area of research and design. The need to design efficient circuits while increasing the lifespan of their batteries has become a primordial. The goal of this special issue is to provide a platform for scientists and academicians to promote, share and discuss in depth various new designs and developments in the area of low-power sensor interface and integrated circuits.

    In this special issue, we would like to invite front-line researchers and authors to submit original research and review articles on exploring low-power sensor interface and integrated circuits. The potential topics include, but are not limited to:

    • Low-power system-on-chip design
    • Energy-efficient algorithm, architecture, and integrated circuits for artificial intelligence
    • Secure, reliable, and low-power integrated circuits design for Internet of Things
    • Wearable biomedical sensor interface and integrated circuits
    • Low-power low-voltage intelligent processor design
    • Software defined sensor interface circuits
    • Low-power FPGA-based design methodologies for IoT
    • Body-bias tuning and methodologies
    • Energy-efficient machine-learning, deep-learning at the edge

    Authors should read over the journal’s For Authors carefully before submission. Prospective authors should submit an electronic copy of their complete manuscript through the journal’s Paper Submission System.

    Please kindly specify the Special Issue” under your manuscript title. The research field “Special Issue – Low-Power Design for Sensor Interface and Integrated Circuit” should be selected during your submission.

    Special Issue timetable:

    Submission Deadline

    July 15th, 2021

    Publication Date

    September 2021

    Guest Editors:

    Prof. Teo Tee Hui, Singapore University of Technology and Design, Singapore

    Prof. Khanh N. Dang, Vietnam National University, Vietnam

    Dr. Akram Ben Ahmed, National Institute of Advanced Industrial Science and Technology (AIST), Japan

    For further questions or inquiries, please contact Editorial Assistant at