Special Issue on Design and Applications of
Wide Bandgap Devices for Power Electronics
The fast development of Wide
Bandgap (WBG) semiconductor devices like silicon carbide (SiC) and gallium
nitride (GaN) devices has led to their drastic expansion in various
applications. With the advantages of high breakdown electric field, low
on-resistance, fast switching speed and high junction temperature capacity, WBG
devices are promising to provide lighter, smaller, cheaper and reliable
solutions, bring another 10-fold overall performance improvement, and
revolutionise future power conversion systems. In recent years, some commercial
and industrial products equipping WBG devices have appeared on the market, yet
there are many challenges to be addressed as those can be found in
manufacturing, packaging, assembly, testing, design, protection, control,
electromagnetic interference (EMI) and health management, making WBG technology
a double-edged sword. This special issue seeks to inform about latest
contributions to existing knowledge that can help to exploit the full potential
and reap the benefits of these devices.
The particular topics of interest include, but are not
limited to:
-
Applications of WBG devices in renewable energies/electric
vehicles/battery chargers/wireless power transfer
-
Gate drivers, passive components, protection, control and
EMI/EMC issues for WBG devices
-
Packaging and heterogeneous integration techniques for
WBG devices
-
Reliability and robustness studies of WBG devices
-
Thermal analysis and temperature management of WBG
device-based power converters
-
Medium voltage (MV) power converters using WBG devices
-
Modelling, simulation and design tools of WBG
device-based power converters
-
Advanced control of WBG power electronics system
Authors
should read over the journal’s For Authors carefully before submission.
Prospective authors should submit an electronic copy of their complete manuscript
through the journal’s Paper Submission System.
Please kindly specify the “Special
Issue” under your manuscript title. The research field “Special Issue – Design and Applications of
Wide Bandgap Devices for Power Electronics” should be selected during your submission.
Special Issue timetable:
Submission Deadline
|
September 15th, 2021
|
Publication Date
|
November 2021
|
Guest Editors:
Dr. Haimeng Wu, Northumbria University, United
Kingdom
Dr. Bing Ji, University of Leicester, United
Kingdom
Dr. Zhiqiang Wang, Dalian University of
Technology, China
For
further questions or inquiries
Please
contact Editorial Assistant at
jpee@scirp.org