Junhui Li

School of Mechanical and Electronical Engineering,

Central South University, China

Professor

Email: lijunhui@csu.edu.cn, ljh_csu@163.com

Qualifications

2003–2008 Ph.D., Mechanical Engineering, Central South University, China

2000–2003 MEng., Mechanical Engineering, Central South University, China

1988–1992 BEng., Mechanical Manufacturing and Automation, Central South University, China

Publications (Selected)

1. Li Junhui, Deng Luhua, Ma Bangke, and Han Lei, Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging,Microelectronics Reliability, 2011, 51: 2236-2242.(IF2010=1.026).
2. Junhui Li, Bangke Ma, Ruishan Wang, Study on A Cooling System Based on Thermoelectric Cooler for Thermal Management of High-power LEDs,Microelectronics Reliability, 2011, 51: 2210-2215.(IF2010=1.026).
3. J. Li, L. Han, J. Duan, J.Zhong, Interface Mechanism of Ultrasonic Flip Chip Bonding, Applied Physics Letters, 2007, 90: 242902.(IF2010=3.820).
4. Junhui Li, Liu Linggang, Deng Luhua, Ma Bangke, Wang Fuliang, Lei Han, Interfacial microstructures and thermodynamics of thermosonic Cu-wire bonding,IEEE Electron Device Letters, 2011, 32(10): 1433-1435.(IF2010=2.714).
5. Junhui Li, Liu Linggang, Ma Bangke, Deng Luhua, Lei Han,Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process,IEEE Electron Device Letters, 2011, 32(12): 1731-1733.(IF2010=2.714).
6. LiJunhui, Zhang Xiaolong, Liu Linggang, and Han Lei, Interfacial characteristics and dynamic process of Au-wire and Cu-wire bonding & overhang bonding in microelectronics packaging,Journal of Microelectromechanical Systems, 2013, Vol.22, No.3, Jun, pp.560-568. (IF2011=2.129)
7. Li Jun-Hui, Wang Ruishan, Han Lei, Wang Fuliang, Long Zhili, HRTEM And X-Ray Diffraction Anylsis Of Au Wire Bonding Interface In Microelectronics Packaging,Solid State Sciences, 2011, (13) 72-76.(IF2010=1.828).
8. JunhuiLi, Wang Fuliang, LeiHanand Jue Zhong, Theoretical and Experimental Analyses of Atom Diffusion Characteristics on Wire Bonding Interfaces, Journal of Physics D: Applied Physics, 2008, 41: 135303.(IF2010=2.200).
9. JunhuiLi, Lei Han, Jue Zhong,Observationson HRTEM features of thermosonic flip chip bonding interface, Materials Chemistry and Physics, 2007, 106(2-3): 457-460.(IF2010=2.325).
10. LiJunhui, Wang Ruishan, HeHu, Wang Fuliang, Han Lei, Zhong Jue, The Law of Ultrasonic Energy Conversion in Thermosonic Flip Chip Bonding Interface, Microelectronic Engineering,2009, 86: 2063-2066.(IF2010=1.488).
11. JunhuiLi, Lei Han, Jue Zhong, Power and Interface Features of Thermosonic Flip Chip Bonding, IEEE Transactions on Advanced Packaging, 2008, 30(3):442-446.(IF2010=1.276).
12. Li Jun-Hui, Duan Ji-an,HanLei, Zhong Jue, Microstructural characteristics of Au/Al bonded interfaces,Materials Characterization, 2007, 58: 103-107.(IF2010=1.496).
13. Junhui Li, Lei Han, JueZhong, Short-Circuit Diffusion of Ultrasonic Bonding Interfaces in Microelectronic Packaging,Surface and Interface Analysis, 2008, 40(5): 953-957.(IF2010=1.247).
14. Ji-an Duan, Junhui Li*, Lei Han, Jue Zhong, Interface features of ultrasonic flip chip bonding and reflow soldering in microelectronic packaging,Surface and Interface Analysis, 2007, 39: 783-786.(IF2010=1.247).
15. LiJunhui, Zhang Xiaolong, Liu Linggang, Deng Luhua, and Han Lei, Effects of Ultrasonic Power and Time on Bonding Strength and Interfacial Atomic Diffusion During Thermosonic Flip-Chip Bonding, IEEE Transation on Components, Packaging and Manufacturing Technology,2012, 2(3): 521-526.