Prof.Yee-Wen
Yen
Department of
Materials Science and Engineering,
National Taiwan University of Science and
Technology, Chinese Taipei
Assiociate
Professor
E-mail: ywyen@mail.ntust.edu.tw
Qualifications
1997-2002 Ph.D.,
Department of Chemical Engineering, National Tsing Hua University, Hinchu,
Chinese Taipei
1995-1997 M.Sc.,
Department of Chemical Engineering, National Tsing Hua University, Hinchu,
Chinese Taipei
1991-1995 B.Sc.,
Department of Chemical Engineering, National Tsing Hua University, Hinchu,
Chinese Taipei
Publications(Selected)
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Substrate Shape Effect on the Sn Whisker Growth in the Electroplating
Matte Sn System, Yee-Wen Yen*, Chao-Kang Li, Meng-Yu Tsou, Japanese Journal of
Applied Physics, Vol. 50, pp. 01BJ07-1-4 (2011). (SCI:1.024)
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Interfacial reactions between high-Pb solders and Ag Source, Chi-Pu Lin,
Chih-Ming, Chen, Yee-Wen, Yen, Hsin-Jay, Wu, Sinn-Wen Chen, Journal of Alloys
and Compounds, Vol. 509, pp. 3509-3514 (2011). (SCI: 2.138)
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ACF Particle Distribution on COG Process, Yee-Wen Yen* and Chun-Yu Lee,
Microelectronics Reliability, vol. 51, pp. 676-684 ( 2011) (SCI:1.101)
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Interfacial reactions and Mechanical Properties between Sn-Ag-Cu and
Sn-Ag-Cu-Ni-Ge Lead-free Solders with Au/Ni/Cu Substrate, Yee-wen Yen*,
Yu-Cheng Chiang, Chien-Chung Jao, Da-Wei Liaw, Shao-Cheng Lo, Chiapyng Lee,
Journal of Alloys and Compounds, Vol. 509, pp. 4595-4602 (2011). (SCI: 2.138)
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Interfacial reactions in the Sn-xBi/Au couples, Yee-wen Yen*, Wei-Kai
Liou, Chao-Ming Chen, Cheng-Kuan Lin, Meng-Kuang Huang, Materials Chemistry and
Physics, Vol. 128, pp. 233-237 (2011). (SCI 2.356)
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Investigation of Interfacial Reactions and Sn Whisker Formation in the
Matte Sn layer with NiP/Ni/Cu and Ni/Cu Multi-layer Systems, Wei-kai Liou ,
Yee-Wen Yen*, Chien-Chung Jao, Meng-Yu Tsou, IEEE Transactions on Component
Packaging Manufacturing (IEEE Transactions on Electronics Packaging
Manufacturing), Vol. 1, June, pp. 951-956 (2011) (SCI: 0.892)
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Interfacial Reactions in the Sn/Fe-xNi couples, Yee-Wen Yen*, Hsien-Ming
Hsiao, Shih-Wei Lin, Pin-Ju Huang, Chiapyng Lee, Journal of Electronic
Materials Vol. 41, pp. 144-152 (2012) (SCI: 1.421)
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Interfacial Reactions on Pb-Free Solders with Au/Pd/Ni/Cu Multilayer
Substrates, Yee-wen Yen*, Po-hao Tsai, Yang-kai Fang, Shao-cheng Lo, Yu-Ping
Hsieh, Chiapyng Lee, Journal of Alloys and Compounds, Vol. 503, pp. 25-30
(2010). (SCI: 2.138)
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Interfacial reactions of Sn-58Bi and Sn-9Zn lead-free solders with the
multilayer Au/Ni/SUS 304 substrate, Yee-wen Yen*, Da-wei Liaw, Kuen-da Chen,
Hao Chen, Journal of Electronic Materials, Vol. 29, pp.2412-2417 (2010)(SCI:
1.421)
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Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial
reactions, Shih-kang Lin, Kuen-da Chen, Hao Chen, Wei-kai Liou, and Yee-wen
Yen*, Journal of Materials Research, Vol. 25, pp. 2278-2286 (2010). (SCI:
1.421)
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Interfacial Reactions between Pb-Free Solders and In/Ni/Cu Multilayer
Substrates, Yee-Wen Yen*, Wei-Kai Liou, Hong-Yao Wei, Chiapyng Lee, Journal of
Electronic Materials, vol. 38, pp.93-99 (2009). (SCI: 1.421)
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Phase Equilibria of the Au-Sn-Zn Ternary System and Interfacial Reactions
in Sn-Zn/Au Couples, Wei-kai Liou and Yee-Wen Yen*, Intermetallics Vol. 17,
pp.72-78 (2009). (SCI: 2.335)
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Interfacial reactions between Lead-free solders and the multilayer
Au/Ni/SUS304SS substrate, Yee-Wen Yen*, Chun-Yu Le, Meng-Han Kuo, Kuo-Sing
Chao, Kuen-da Chen, International Journal of Materials Research, Vol. 100, pp.
672-676 (2009). (SCI: 0.860)
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Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au
substrate, Wei-kai Liou, Yee-Wen Yen*, Kuen-Da Chen, Journal of Alloys and
Compounds, Vol. 479, pp. 225-229 ( 2009). (SCI: 2.138)
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Cross-interaction between Au/Sn and Cu/Sn interfacial reaction, Yee-Wen
Yen, H. W. Tseng, K. Zeng , S.J. Wang, C.Y Liu, Journal of Electronic
Materials, Vol. 38, pp. 2257-2263 (2009) (SCI: 1.421)
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Interfacial reactions between Ni/430 stainless steel as the interconnect
material and Ag–Cu alloy fillers in a solid oxide fuel cell system, Yee-Wen
Yen*, Chun-Yu Lee, Don-Ping Huang and Jian-Wei Su, Journal of Alloys and
Compounds, vol. 466, pp. 383-386 (2008). (SCI: 2.138)
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Synthesize carbon nanotubes by a novel method using chemical vapor
deposition-fluidized bed reactor from solid-stated polymers, Yee-Wen Yen*,
Ming-De Huang and Fu-Jen Lin, Diamond and Related Materials, vol. 17,
pp.567-570 (2008). (SCI: 1.825)
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Investigation of Dissolution Behavior of Metallic Substrates and
Intermetallic Compounds in Molten Lead-free Solders, Yee-Wen Yen*, Weng-Ting
Chou, Yu Tseng, Chiapyng Lee , Chung-Lei Hsu, Journal of Electronic Materials,
vol. 37, pp.73-83 (2008) (SCI: 1.421)
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Phase Equilibria of the Sn-Sb-Ag Ternary System and Interfacial Reactions at
the Sn-Sb/Ag Joints at 400°C and 150°C, Chung-Yung Lin, Chiapyng Lee, Xingjun
Liu and Yee-Wen Yen, Intermetallics, vol. 16, pp.230-238 (2008). (SCI: 2.335)
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The 260°C phase equilibria of the Sn-Sb-Ag ternary system and interfacial
reactions at the Sn-Sb/Ag joints, Chiapyng Lee, Chung-Yung Lin, and Yee-Wen
Yen, Journal of Alloys and Compounds, vol. 458, pp. 436-445 (2008) (SCI: 2.138)
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Effect upon Minor Addition of Pb on Interfacial Reactions and Mechanical
Properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu Joints, Yee-Wen Yen*, Weng-Ting
Chou, Hong-Chih Chen, Wei-kai Liou, Chiapyng Lee, International Journal of
Materials Research, Vol. 99, pp.1251-1256 (2008). (SCI: 0.860)
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Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au
Quaternary Systems and Interfacial Reactions in Sn-Cu/Au couples, Yee-Wen Yen*,
Chien-Chung Jao, Hsien-Ming Hslao, Chung-Yung Lin and Chiapyng Lee, Journal of
Electronic Materials, Vol. 36, pp. 147-158 (2007). (SCI: 1.421)
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Investigation of thermal stability of Mo Thin-Film as the Buffer Layer and
Cu Metallization for Application in TFT-LCDs, Yee-Wen Yen*, Yu-Lin Kuo, Jian-Yu
Chen, Hung-Yao Wei, Chiapyng Lee, Chung-Yu Lee and Hsin-Hung Lee, Thin Solid
Films, Vol. 515, pp. 7209-7216 (2007). (SCI: 1.935)
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Study of Interfacial Reactions between Sn-Ag-Cu Alloys and Au Substrate,
Chien-Chung Jao, Yee-Wen Yen*, Shu-Hao Zhang, Chung-Yung Lin, Chiapyng Leee,
International Journal of Materials Research, Vol. 98, pp. 496-500 (2007). (SCI:
0.860)
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Electroenhanced Metallorganic Chemical Vapor Deposition of Copper
Films, Yu-Lin Kuo, Chiapyng Lee, Gene Chen, Kou-Liang Liu, Yee-Wen Yen,
Electrochemical and Solid-State Letters, Vol. 10, pp. 51-54 (2007). (SCI:
1.981)
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The 260°C Phase Equilibria of the Sn-Sb-Cu Ternary System and Interfacial
Reactions at the Sn-Sb/Cu Joints Chiapyng Lee, Chung-Yung Lin, and Yee-Wen Yen,
Intermetallics, vol. 15, pp.1027-1037 (2007). (SCI: 2.335)