1998 M.S., Engineering Thermophysics, Huazhong University of Science and Technology, China
1995 B.S., Engineering Thermophysics, Huazhong University of Science and Technology, China
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Xiao-Bing Luo, Hye-Jung Cho, Valveless small gas pump, Nanoscale and Microscale Thermophysical Engineering, 10 (2) (2006): 83-94
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Xing Yang, Zhaoying Zhou, Hyejung Cho, Xiaobing Luo, Study on a PZT-actuated diaphragm pump for air supply for micro fuel cells, Sensors and Actuators A, Physical, 130-131(2006): 531-536
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X. B. Luo, Z. X. Li, Z. Y. Guo, Y. J. Yang, Study on linearity of a micromachined convective accelerometer, Microelectronic Engineering, 65(1-2) (2003): 87-101
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X. B. Luo, Z. X. Li, Z. Y. Guo, Y. J. Yang, Thermal optimization on micromachined convective accelerometer, Heat and Mass Transfer, 38(7-8) (2002): 705-712
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X. B. Luo, Z. X. Li, Z. Y. Guo, Principle and simulation on a novel valveless micropump, China Mechanical Engineering, 13(15) (2002): 1261-1264 (In Chinese)
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X. B. Luo, Y. J. Yang, F. Zheng, Z. X. Li, Z.Y. Guo, An optimized micromachined convective accelerometer with no proof mass, Journal of Micromechanics and Microengineering, 11(5) (2001): 504-508
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Xiaobing Luo, Bulong Wu, Sheng Liu, Effects of Moist environments on LED module reliability, IEEE Transactions on Device and Materials Reliability, Vol. 10 (2): 182-186, 2010
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Xiaobing Luo*, Zhangming Mao, Sheng Liu, An analytical thermal resistance model for calculating mean die temperature of a typical BGA packaging, Thermochim. Acta (2010), doi:10.1016/j.tca.2010.10.009
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Ting Cheng,Xiaobing Luo*, Suyi Huang, Sheng Liu, Thermal analysis and optimization of multiple LED packaging based on a general analytical solution, International Journal of Thermal Sciences, 49 (2010):196-201.（* Corresponding author）
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Yanyan Xi,Xiaobing Luo*, Wenming Liu, Mingxiang Cheng, Sheng Liu, Studyon localized induction heating for wafer level packaging, Science in China Series E-Technological Sciences, Vol. 53(3):800-806, 2010 (*Corresponding author)
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Xuefang Wang, Chuan Liu, Zhuo Zhang, Sheng Liu, Xiaobing Luo*, A micro-machined Pirani gauge for vacuum measurement of ultra-small sized vacuum packaging, Sens. Actuators A: Phys. (2010), Vol.161, pp: 108-113 (* Corresponding author)
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Kai Wang, Fei Chen, Zongyuan Liu, Xiaobing Luo, Sheng Liu. Design of compact freeform lens for application specific light-emitting diode packaging. Optics Express, 2010, 18: 413-425
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Kai Wang, Dan Wu, Fei Chen, Zongyuan Liu, Xiaobing Luo and Sheng Liu, Angular color uniformity enhancement of white light-emitting diodes integrated with freeform lenses, Optics Letters, Vol.35, No.11, pp.1860-1862, 2010
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Zongyuan Liu, Sheng Liu, Kai Wang, Xiaobing Luo. Measurement and numerical studies of optical properties of YAG: Ce phosphor for white LED packaging. Applied Optics, 2010, 49: 247-257
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Zongyuan Liu, Sheng Liu, Kai Wang,Xiaobing Luo. Comment on “Enhancement of flip-chip white light-emitting diode with a one- dimensional photonic crystal”. Optics Letters, 2010, 35: 1758
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Zongyuan Liu, Kai Wang,Xiaobing Luo, Sheng Liu. Precise optical modeling of blue light-emitting diodes by Monte Carlo ray-tracing. Optics Express, 2010, 18: 9398-9412
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Qin, Zong;Wang, Kai;Chen, Fei;Luo, Xiaobing;Liu, Sheng, Analysis of condition for uniform lighting generated by array of light emitting diodes with large view angle, Optics Express, v 18, n 16, p 17460-17476, August 2, 2010
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Chen, Fei;Wang, Kai;Qin, Zong;Wu, Dan;Luo, Xiaobing;Liu, Sheng, Design method of high-efficient LED headlamp lens, Optics Express, v 18, n 20, p 20926-20938, September 27, 2010
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Xiaobing Luo, Wei Xiong, Ting Cheng, Sheng Liu, Temperature estimation of high power LED street lamp by a multi-chip analytical solution, IETOptoelectronics, Vol. 3(5): 225-232, 2009
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L. L. Yuan, S. Liu, M. X. Chen, X. B. Luo, Thermal analysis of high power LED array packaging with microchannel cooler, Semiconductor Optoelectronics, 27(6), p712-716, December, 2006. (In Chinese)