has been cited by the following article(s):
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[1]
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Effect of alloying elements on microstructural and electrical property in Sn–Cu–Bi lead-free solder alloys
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Ezzi, E Kader, S Alazzawi - Welding International,
2024 |
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[2]
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Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method
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Journal of Materials …,
2023 |
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[3]
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Effect of deposition potential on electrodeposition of Sn-Ag-Cu ternary alloy solderable coating in deep eutectic solvent
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Journal of …,
2023 |
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[4]
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Effect of Strain Rate on Tensile Behavior of Sn-9Zn-xAg-ySb;{(x, y)=(0.2, 0.6),(0.2, 0.8),(0.6, 0.2),(0.8, 0.2)} Lead-Free Solder Alloys
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Materials Sciences and Applications,
2023 |
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[5]
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Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems
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Journal of Materials Science …,
2022 |
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[6]
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Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties
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Materials & Design,
2022 |
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[7]
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Design of composite foil anodes for lithium-ion batteries
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2021 |
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[8]
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Prediction of activities of all components in Sn-Ag-Cu and Sn-Ag-Cu-Zn lead-free solders using modified molecular interaction volume model
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2021 |
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[9]
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Zn-Sn Interdigitated Eutectic Alloy Anodes with High Volumetric Capacity for Lithium-Ion Batteries
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2019 |
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[10]
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Effect of Bi and Cu Element in Lead Free Solders During Multiple Reflow Process
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2019 |
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[11]
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Mechanical Properties of Liquid Metal After Solidified
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Liquid Metal Biomaterials,
2018 |
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[1]
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Influence of bismuth addition on the microstructure, wettability, thermal properties and electrical resistivity of Sn–Zn-based solder alloys
Welding International,
2025
DOI:10.1080/09507116.2025.2462692
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[2]
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Effect of alloying elements on microstructural and electrical property in Sn–Cu–Bi lead-free solder alloys
Welding International,
2024
DOI:10.1080/09507116.2024.2317322
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[3]
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Reference Module in Materials Science and Materials Engineering
2019
DOI:10.1016/B978-0-12-803581-8.11575-9
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