TITLE:
Mechanical Properties of Micro- and Nanostructured Copper Films
AUTHORS:
N. Kosarev, M. Khazin, R. Apakashev, N. Valiev
KEYWORDS:
Nano- and Microcrystalline Materials; Hall-Petch Relation; Yield Point Stress; Grain Boundary Hardening Coefficient; Nonequilibrium Grain Boundaries
JOURNAL NAME:
Journal of Materials Science and Chemical Engineering,
Vol.1 No.5,
November
7,
2013
ABSTRACT:
Mechanical properties of electrodeposited and
electroless copper with nano- and crystalline structure are considered. Grain
diameters in films ranged from 0.06 to 8 μm. A model is described which takes
into account the grain boundary hardening and density of dislocation.