Article citationsMore>>

A. Mertol, “Thermal Performance Comparison of High Pin Count Cavity-Up Enhanced Plastic Ball Grid Array (EPBGA) Packages,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, Vol. 19, No. 2, 1996, pp. 427-443.

has been cited by the following article:

Follow SCIRP
Twitter Facebook Linkedin Weibo
Contact us
+1 323-425-8868
customer@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1655362766
Paper Publishing WeChat
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top