TITLE:
Literature Review of Electronic Packaging Technology and Residual Stress
AUTHORS:
Wenji Ai, Shanshui Zheng, Xianfeng Zeng, Huibing Cheng
KEYWORDS:
Electronic Packaging Material, Residual Stress, Epoxy, Failure Mechanisms
JOURNAL NAME:
Open Journal of Applied Sciences,
Vol.13 No.11,
November
29,
2023
ABSTRACT: The rapid development of the electronic information industry brings to
the irreplaceable role of electronic components, therefore the search of a more
reliable packaging material has become increasingly important. In the
electronic packaging system, the failure phenomenon caused by residual stress
is one of the key factors restricting the development of electronic packaging
technology. In order to use the in-situ characterization technology to explore the residual stress inducing mechanism
and failure mechanism of epoxy-based advanced packaging materials, this paper
gives a review of related previous research, and lays a
theoretical foundation for the upcoming research. The classification and
generation mechanism of residual stress are clarified in this paper, which
provides data support for future related research.