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Wang, P., Takizawa, S., He, D., Ge, F., Wang, O., Ye, F., Liang, P. and Tan, K.G. (2017) DDR4 Dual-Contact Interconnect Methodology, Component, and Board Level Reliability. 18th International Conference on Electronic Packaging Technology, Harbin, 16-19 August 2017, 1337-1344.
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