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M. Dudek, L. Hunter, S. Kranz, J. J. Williams, S. H. Lau and N. Chawla, “Three-Dimensional (3D) Visualization of Reflow Porosity and Modeling of Deformation in Pb- Free Solder Joints,” Materials Characterization, Vol. 61, No. 4, 2009, pp. 433-439. doi:10.1016/j.matchar.2010.01.011

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