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Wang, H., Lee, K.S., Ryu, J.H., Hong, C.H. and Cho, Y.H. (2008) Active Packaging Method for Light-Emitting Diode Lamps with Photosensitive Epoxy Resins. IEEE Photonics Technology Letters, 20, 87-91.
http://dx.doi.org/10.1109/LPT.2007.910760
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