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Kim, Y.M., Park, J. and Kim, Y. (2012) Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish. Journal of Electronic Materials, 41, 763-773.
http://dx.doi.org/10.1007/s11664-012-1921-0

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