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Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK)

Changsha,China,10.16-10.18,2010

ISBN: 978-1-935068-41-9 Scientific Research Publishing, USA

E-Book 2313pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $360

Title: Preparing and Study on Thermal-Conductive Epoxy Resin/M Composites
Source: Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK) (pp 1915-1918)
Author(s): Hui-xia Feng, College of Petrochemical Engineering, Lanzhou University of Technology, LanZhou 730050, China
Guo-hong Zhang, College of Petrochemical Engineering, Lanzhou University of Technology, LanZhou 730050, China
Jing-chen Liu, College of Petrochemical Engineering, Lanzhou University of Technology, LanZhou 730050, China
He-ming Luo, College of Petrochemical Engineering, Lanzhou University of Technology, LanZhou 730050, China
Abstract: In this paper, an efficient method for the surface modification of the metal-powder with high thermal conductivity using silicane coupling agent(KH570), stearic acid(SA) as surface modification agents was developed. A new type of composite material with good thermal conductivity was prepared when we added the modified metal powder into the curing agent of Epoxy resin(EP) system. The experimental results were showed that the thermal conductivity of the EP/KH570-M will increase with the padding dosage increasing. In addition, EP/KH570-Ag is of the largest thermal conductivity. The mechanical properties of the composites were strengthened after the modification. The composites have the greatest tensile strength when the amount of filler was 20%.
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