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Author(s): |
Li-li Zhou, School of Physics and Microelectronics Science, Hunan University, Changsha 410082, China Department of Information Engineering, Gannan Medical University, Ganzhou 341000, China
Rang-su Liu, School of Physics and Microelectronics Science, Hunan University, Changsha 410082, China
Ze-an Tian, School of Physics and Microelectronics Science, Hunan University, Changsha 410082, China
Quan-hui Liu, School of Physics and Microelectronics Science, Hunan University, Changsha 410082, China |
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Abstract: |
A molecular dynamics simulation study was performed for the cooling rate effects on the microstructure evolution during the rapid solidification process. The bond-type index method of Honeycutt-Andersen (HA), the cluster type index method (CTIM), and the visual analysis method have been used to analyze the evolution of micro-structures during the solidification. The results shows that the higher cooling rate corresponding to a higher glass transition temperature; moreover, the (12 0 12 0) icosahedron basic clusters plays a key role on the formation of the amorphous structure, they are inter-percolated into each other and form a network in the system; it has also been found that the cooling rate effects on the solidification structure only shows up bellows 773 K, the smaller the cooling rate is, the more icosahedron basic clusters form, and the more easy of the big size nano-cluster to form in the system.
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