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Author(s): |
Qing Feng, Northwest Institute for Non-forrous Metal Research Huatai Co., Ltd. Xi’an, China
Sheng Feng, Northwest Institute for Non-forrous Metal Research Huatai Co., Ltd. Xi’an, China
Wen-bo Yang, Northwest Institute for Non-forrous Metal Research Huatai Co., Ltd. Xi’an, China
Ping-sheng Tang, Northwest Institute for Non-forrous Metal Research Huatai Co., Ltd. Xi’an, China |
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Abstract: |
The effects of various factors concentration of non-bright tin electroplating in methanesulfonic acid on the electroplating quality were discussed. The optimal conditions of methanesulfonic acid electroplating tin process were study. The thickness, composition of the tin surface and solderability of the samples were studied using SEM, electrical impedance spectroscopy, and solderability test, respectively. The test results show that tin deposit was compact, flat and no tin whiskers growth was found. Tin coating containing 99.5wt％ tin has been obtained. When the thickness of deposit was between 7 to 16μm, the tin deposit has good solderability. Heat treatment has a large effect on the soderability of tin deposit.
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