•   Home
  • Proceedings
  • Proceedings of the 7th National Conference on Functional Mat...

Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK)

Changsha,China,10.16-10.18,2010

ISBN: 978-1-935068-41-9 Scientific Research Publishing, USA

E-Book 2313pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $360

Title: Preparation and Thermal Stability of Polyorganosiloxane Superhydrophobic Film by Sol-gel Method
Source: Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK) (pp 1602-1609)
Author(s): Hao-wei Yang, Department of Materials Science, Fudan University, Shanghai 200433, P. R. China
Fei Xiao, Department of Materials Science, Fudan University, Shanghai 200433, P. R. China
Abstract: Silica sol with hydrophobic surface groups is prepared by a two step acid-base hydrolysis and condensation procedure with a mixture of methyltriethoxysilane and propyltriethoxysilane as precursors. The partial substitution of methyl on silicon by propyl group enlarges the degree of phase incompatibility between silica sol skeleton and solvent. Meanwhile, the gelling time is controlled by dilution with extra solvent during sol aging, which makes the sol compatible with thin film processing. The gel skeleton coarseness can be modified by controlling the amount of deionized water added to the sol before the film preparation. The thin films with a hierarchical structure are obtained by dip coating, with a contact angle of water more than 155° and contact angle hysteresis less than 5°. As the treating temperature increases, the water drop does not tend to slide off and the contact angle decreases. The FTIR, TGA-DTA data and SEM morphology observation indicate that both the merging of nano particles on gel skeleton and the decomposition of hydrophobic groups on the surface lead to the loss of superhydrophobicity.
Proceedings by Subjects
Resources
Products
Contact us
book@scirp.org
WhatsApp +86 18163351462(WhatsApp)
Click here to send a message to me 1243940697
Book Publishing WeChat
Follow SCIRP
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top