Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK)

Changsha,China,10.16-10.18,2010

ISBN: 978-1-935068-41-9 Scientific Research Publishing, USA

E-Book 2313pp Pub. Date: October 2010

Category: Chemistry & Materials Science

Price: $360

Title: The Simulation of Output Characteristics of DSSC Based on MATLAB/Simulink
Source: Proceedings of the 7th National Conference on Functional Materials and Applications (FMA 2010 E-BOOK) (pp 1095-1099)
Author(s): Jiao Kang, School of Chemistry Engineering & Material, Dalian Polytechnic University, Dalian 116034, China
Zhi-qiang Hu, School of Chemistry Engineering & Material, Dalian Polytechnic University, Dalian 116034, China
Hong-ru Zhou, School of Chemistry Engineering & Material, Dalian Polytechnic University, Dalian 116034, China
Qian-xin Zhan, School of Chemistry Engineering & Material, Dalian Polytechnic University, Dalian 116034, China
Abstract: According to the equivalent circuit of Dye-Sensitized Solar Cells (DSSC), a simulation model was created using MATLAB/Simulink tool, which was used to simulate the output characteristics and output power of DSSC, and the effect of photo current density, diode factor and initial currents of diode on the performance of DSSC were investigated. The results indicated that the density of short-circuit current, the open-circuit voltage and the maximum output power increased with increasing photo current density, and the fill factor increased firstly and then decreased. The open-circuit voltage, and the maximum output power increased with increasing diode factor, and the fill factor increased firstly and then decrease, yet the density of short-circuit current kept constant. The open-circuit voltage, and the maximum output power and the fill factor increased with increasing diode factor, yet the density of short-circuit current kept constant. The simulation results can be used as the theoretical basis for optimization DSSC.
Free SCIRP Newsletters
Copyright © 2006-2024 Scientific Research Publishing Inc. All Rights Reserved.
Top