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Author(s): |
Jing-wu Zheng, Department of Chemical and Materials Engineering, Zhejiang University of Technology, Hangzhou 310032, P. R. China
Guo-ying Lu, Department of Chemical and Materials Engineering, Zhejiang University of Technology, Hangzhou 310032, P. R. China
Liang Qiao, Department of Chemical and Materials Engineering, Zhejiang University of Technology, Hangzhou 310032, P. R. China
Li-qiang Jiang, Department of Chemical and Materials Engineering, Zhejiang University of Technology, Hangzhou 310032, P. R. China
Mei-yan Jiang, Department of Chemical and Materials Engineering, Zhejiang University of Technology, Hangzhou 310032, P. R. China |
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Abstract: |
A cyanide-free alkaline copper deposition bath was developed using Methylene Diphisphonic Acid(MDPA).In this study,the tri-isopropyl phosphate was coupled with dibromomethane to from MDPA,the structures were characterized by 1H-NMR、13C-NMR、31P-NMR and ES-MSI methods. The IR spectra of the solid complex purified from the bath showed that the ligand binding affinity between MDPA and Cu is stronger with the increasing pH, and also the complxing state is changing. The electrochemical behavior of Cu electroplating in MDPA solution was studied at pH=9 by cathodic polarization curves at 10℃ and 20℃ comparig with HEDPA solution. The results showed that the MDPA potential have a negative shit ,also, the rate of diffusion is faster.
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