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STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials

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DOI: 10.4236/jectc.2013.34016    8,562 Downloads   13,509 Views   Citations


As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.

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The authors declare no conflicts of interest.

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Anderson, K. , Devost, M. , Pakdee, W. and Krishnamoorthy, N. (2013) STAR CCM+ CFD Simulations of Enhanced Heat Transfer in High-Power Density Electronics Using Forced Air Heat Exchanger and Pumped Fluid Loop Cold Plate Fabricated from High Thermal Conductivity Materials. Journal of Electronics Cooling and Thermal Control, 3, 144-154. doi: 10.4236/jectc.2013.34016.


[1] “Thermacore k-Core Data Sheet,” 2013.
[2] D. D. L. Chung and Y. Takizawa, “Performance of Isotropic and Anisotropic Heat Spreaders,” Journal of Electronic Materials, Vol. 41, No. 9, 2012, pp. 2580-2587.
[3] Y. S. Yoon, H. Yang and H. Y. Kwak, “Enhancement of the Critical Heat Flux by Using Heat Spreader,” KSME International Journal, Vol. 17, No. 7, 2003, pp. 1063-1072.
[4] K. J. Gray, “Effective Thermal Conductivity of a Diamond Coated Heat Spreader,” Diamond and Related Materials, Vol. 9, No. 2, 2000, pp. 201-204.
[5] P. Mohan, and P. Govindarajan, “Thermal Analysis of CPU with CCC and Copper Base Plate Heat Sinks Using CFD,” Heat Transfer Asian Research, Vol. 40, No. 3, 2011, pp. 217-232.
[6] A. Part, R. Linton and D. Agonafer, “Coarse and Detailed CFD Modeling of a Finned Heat Sink,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 18, No. 3, 1995, pp. 517-520.
[7] P. Mohan and P. Govindarajan, “Experimental and CFD Analysis of Heat Sinks with Base Plate for CPU Cooling,” Journal of Mechanical Science and Technology, Vol. 25, No. 8, 2011, pp. 2003-2012.
[8] J. Yang, W. Wang and L. Huazhi, “2-Dimensional CFD Simulation and Correlation Development for Optimization of Fin Heatsinks in Electronic Cooling,” Journal of Thermal Science, Vol. 10, No. 4, 2001, pp. 363-371.
[9] E. Ozturk and I. Tari, “CFD Modeling of Forced Cooling of Computer Chassis,” Engineering Applications of Computational Fluid Mechanics, Vol. 1, No. 4, 2007, pp. 304-313.
[10] V. Eveloy, J. Lohan, and P. Rodgers, “A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component-Printed Circuit Board Heat Transfer,” IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, 2000, pp. 568-578.
[11] I. Tari and Y. Fidan-Seza, “CFD Analyses of a Notebook Computer Thermal Management System and a Proposed Passive Cooling Alternative,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, 2010, pp. 443-452.
[12] A. Part and P. G. Tucker, “CFD Applied to Electronic Systems: A Review,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 20, No. 4, 1997, pp. 518-529.
[13] T. Y. Lee and M. Mahalingam, “Application of a CFD Tool for System Level Thermal Simulation,” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, Vol. 17, No. 4, 1994, pp. 564-572.
[14] T. Y. Lee, B. Chambers and M. Mahalingam, “Application of a CFD Technology to Electronic Thermal Management,” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B,” Vol. 18, No. 3, 1995, pp. 511-520.
[15] S. Aradag, U. Olgun, F. Aktuk and B. Baskbuyuk, “CFD Analysis of Cooling Electronic Equipment as an Undergraduate Project,” Wiley Periodicals Inc., 2009.
[16] J. Choi, Y. Kim, A. Sivasubramaniam, J. Srebric, Q. Wang and J. Lee, “A CFD Based Tool for Studying Temperature in Rack Mounted Servers, IEEE Transactions on Computers,” Vol. 57, No. 8, 2008, pp. 1129-1142.
[17] A. Almodi, A. Thompson, N. Kapur, J. Summers, H. Thompson G. and Hannah, “Computational Fluid Dynamics Investigation of Liquid Rack Cooling in Data Centres,” Applied Energy, Vol. 89, No. 1, 2012, pp. 150-155.
[18] J. Rambo and Y. Joshi, “Modeling of Data Center Airflow and Heat Transfer: State of the Art and Future Trends,” Distributed Parallel Databases, Vol. 21, No. , 2007, pp. 193-225.
[19] R. Boukhanouf and A. Haddad, “A CFD Analysis of an Electronics Cooling Enclosure for Application in Telecommunication Systems,” Applied Thermal Engineering, Vol. 30, No. 16, 2010, pp. 2426-2434.
[20] Z. Khatir, J. Paton, H. Thompson, N. Kapur, V. Toropov, M. Lawres and D. Kirk, “Computational Fluid Dynamics (CFD) Investigation of Air Flow and Temperature Distribution in a Small Scale Bread-Baking Oven,” Applied Energy, Vol. 89, No. 1, 2012, pp. 89-96.
[21] D. B. Flowers and K. R. Anderson, “Numerical Simulation of Conduction Heat Transfer in a System of Slowly Rotating Concentric Shells Separated by Small Annular Gap Distances,” Numerical Heat Transfer Part A, Vol. 46, No. 9, 2004, pp. 1-17.
[22] K. R. Anderson, “CFD Analysis of OPALS Sealed Enclosure Electronics Sub-System,” Proceedings from the Thermal & Fluids Workshop, NASA JPL, Pasadena, 2012.
[23] Y. A. Cengel, “Heat Transfer—A Practical Approach,” McGraw-Hill, New York, 2010.
[24] F. P. Incropera and D. P. Dewitt, “Heat Transfer,” McGraw-Hill, New York, 1991.
[25] G. Ellison, “Thermal Computations for Electronics—Conductive, Radiative, and Convective Air Cooling,” CRC Press, Boca Raton, 2011.
[26] “Graftech Data Sheet,” 2013.
[27] D. G. Gilmore, “Spacecraft Thermal Control,” Aerospace Press, El Segundo, 2002.
[28] “Chotherm Data Sheet,” 2013.
[29] M. A. Ismail, M. Z. Abdullah and M. A. Mujeebu, “A CFD Based Analysis on the Effect of Free Stream Cooling on the Performance of Micro Processor Heat Sinks,” International Communications in Heat and Mass Transfer, Vol. 35, No. 6, 2008, pp. 771-778.

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