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Electrodeposition of Bi-Sb alloy using Cu electrodes

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DOI: 10.4236/msa.2012.37069    5,076 Downloads   6,850 Views   Citations

ABSTRACT

Bi-Sb alloys were grown by means of an electrodeposition method using Cu electrodes. The alloys were studied with the help of an x-ray diffractometer and an electron probe microanalysis. The both investigations have shown no trace of Cu in the obtained alloys. It can be concluded that Cu electrodes can be used for the deposition of Bi-Sb alloys; which results in an advantage of availability of the electrode.

Conflicts of Interest

The authors declare no conflicts of interest.

Cite this paper

M. Ohmukai and A. Tsuyoshi, "Electrodeposition of Bi-Sb alloy using Cu electrodes," Materials Sciences and Applications, Vol. 3 No. 7, 2012, pp. 492-494. doi: 10.4236/msa.2012.37069.

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