has been cited by the following article(s):
[1]
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Use of nano structures for thermal mode of on-board appliances of space appliances
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2019 |
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[2]
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ADVANCES IN NANOFLUIDICS RESEARCH
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2017 |
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[3]
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Thermal Characterisation Analysis of Heat-Sink Heat Pipes under Forced Convection
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Int. J. Mech. Eng. Autom,
2015 |
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[4]
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COMPUTER AIDED-THERMAL MODULE DESIGN
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International Journal of Computer Research,
2014 |
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[5]
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U-and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
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Microelectronics Reliability, Elsevier,
2014 |
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[6]
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Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection
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?International Communications in Heat and Mass Transfer? ,
2014 |
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[7]
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L-and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas
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Heat and Mass Transfer, Springer,
2014 |
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[8]
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Study of Heat Transfer Process from a Circuit Board using Heat Pipes
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2013 |
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[9]
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A fitting, simple and versatile window program (HSHPTM) design using lumped parameters and one-dimensional thermal resistance mo
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Heat and Mass Transfer, Springer,
2013 |
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[10]
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HSHPTM program application in optimum of heat pipes thermal module
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2012 |
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[11]
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Insert Molding Process Employing Vapour Chamber
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Some Critical Issues for Injection Molding,
2012 |
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[12]
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Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system
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International Communications in Heat and Mass Transfer? ,
2012 |
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[13]
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Air cooling module applications to consumer-electronic products
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Heat Transfer-Engineering Applications,
2011 |
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[1]
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Use of nano structures for thermal mode of on-board appliances of space appliances
XLIII ACADEMIC SPACE CONFERENCE: dedicated to the memory of academician S.P. Korolev and other outstanding Russian scientists – Pioneers of space exploration,
2019
DOI:10.1063/1.5133176
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[2]
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U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
Microelectronics Reliability,
2014
DOI:10.1016/j.microrel.2014.02.034
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|
|
[3]
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L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas
Heat and Mass Transfer,
2014
DOI:10.1007/s00231-014-1358-5
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[4]
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Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection
International Communications in Heat and Mass Transfer,
2014
DOI:10.1016/j.icheatmasstransfer.2014.07.023
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[5]
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A fitting, simple and versatile window program (HSHPTM) design using lumped parameters and one-dimensional thermal resistance models
Heat and Mass Transfer,
2013
DOI:10.1007/s00231-012-1061-3
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[6]
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Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system
International Communications in Heat and Mass Transfer,
2012
DOI:10.1016/j.icheatmasstransfer.2012.01.015
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[7]
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HSHPTM program application in optimum of heat pipes thermal module
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
2012
DOI:10.1109/IMPACT.2012.6420248
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