Journal of Electronics Cooling and Thermal Control

Journal of Electronics Cooling and Thermal Control

ISSN Print: 2162-6162
ISSN Online: 2162-6170
www.scirp.org/journal/jectc
E-mail: jectc@scirp.org
"Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules"
written by Rick Sturdivant, Astacian Bogdon, Edwin K. P. Chong,
published by Journal of Electronics Cooling and Thermal Control, Vol.7 No.1, 2017
has been cited by the following article(s):
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