Wave Processes and Mass Transfer on the Copper-Stainless Steel Interface under Solid Phase Bonding by High-Temperature Rolling

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DOI: 10.4236/ojmetal.2018.84005    605 Downloads   1,210 Views  Citations

ABSTRACT

The paper presents the study of hierarchy of deformation wave-processes from nano- to macro-structural level, which takes place in dissimilar materials, bonded by high-temperature vacuum rolling in solid phase. The focus was on the processes that occur on the interface of the bonded materials: mass trasfer of impurities and alloying elements stimulated by deformation, the study of nano- and micro-hardness.

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Borts, B. , Parkhomenko, A. , Vorobyov, I. and Lopata, A. (2018) Wave Processes and Mass Transfer on the Copper-Stainless Steel Interface under Solid Phase Bonding by High-Temperature Rolling. Open Journal of Metal, 8, 67-74. doi: 10.4236/ojmetal.2018.84005.

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