Author(s)

Mehdi Simiari, Ramin Roozehdar Mogaddam^*

Faculty of Science, Emam Ali University, Tehran, Iran.

In this paper, different steps of work and experiments that are done in order to implant nitrogen ion in silicon with the energy of 25 keV, density of 24 μA/cm² and doses of 5 × 10¹³ atom/cm², 1 × 10¹⁴ atom/cm² and 1 × 10¹⁵ atom/ cm² (according to the calculation and applying time at planting) at room temperature (in the lack of heat phase) and without annealing will be presented. The XRD analysis is done before and after planting to observe changes in the lattice and the possibility of forming a crystalline phase of silicon nitride in this case. Also, the study of changes in the lattice arrangement and AFM analysis is done to observe the topography of the surface. Besides, the investigation on surface roughness and changes caused by ion implantation on the surface and spectrophotometry analysis before and after planting due to the study of changes in optical properties are done.

Silicon Wafer, Nitrogen Ion Implantation, XRD Analysis, AFM Analysis, Spectrophotometry Analysis

Simiari, M. and Mogaddam, R. (2017) Characteristics of a Silicon Wafer <111> and <004> after Planting Nitrogen. Advances in Materials Physics and Chemistry, 7, 173-187. doi: 10.4236/ampc.2017.75014.