In semiconductor manufacturing process, probe station that is testing equipment is important. Inspection step is for detecting defects on semiconductor before the packaging. Probe card is a part of probe station and contains probe tip that contacts to semiconductor. Through probe tip, it can inspect defects of semiconductor. In this paper, optimization method is used with response surface analysis to design MEMS type probe tip. And fabricating probe tip uses maskless lithography, electro-plating and lapping process.