Journal of Minerals and Materials Characterization and Engineering

ISSN Print: 2327-4077    ISSN Online: 2327-4085

Call For Papers

    Special Issue on Copper and Its Compounds

    Copper and compounds has a widespread use in a range of applications. It is used to make electrical products and electronics (electrical generators and motors, electrical power and lighting fixtures, electrical wiring, radio and television sets, computers, air-conditioning systems and other electrical appliances), in building construction (water pipes, roof coverings), equipment and heating (refrigeration units, motor vehicle radiators, home heating systems, steam condensers), and chemical and pharmaceutical manufacturing. Copper forms many alloys such as bronze (with tin), brass (with zinc) and monel metal (with nickel), also used in a variety of industries. The goal of this special issue is to provide a platform for scientists and academicians all over the world to promote, share, and discuss various new issues and developments in this area of Copper and Its Compounds.

    In this special issue, we invite front-line researchers and authors to submit original research and review articles that explore Copper and Its Compounds. In this special issue, potential topics include, but are not limited to:

    • Physical properties of Copper
    • Chemical properties of Copper
    • Copper composite
    • Copper nanomaterials
    • Copper alloy
    • Applications of copper compounds

    Authors should read over the journal’s For Authors carefully before submission. Prospective authors should submit an electronic copy of their complete manuscript through the journal’s Paper Submission System.

    Please kindly specify the Special Issue” under your manuscript title. The research field “Special Issue - Copper and Its Compounds” should be selected during your submission.

    Special Issue timetable:

    Submission Deadline

    September 19th, 2019

    Publication Date

              November 2019

    Guest Editor:

    For further questions or inquiries

    Please contact Editorial Assistant at