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Study on the Coupling Packaging Theory and the Key Techniques for Arrayed Waveguide Devices
阵列波导器件耦合封装机理及其关键技术研究: pp.82-111

第三章阵列波导器件对准耦合工艺与算法研究

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ISBN: 978-1-61896-097-9 (Paperback) (USD 19.00)

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第三章阵列波导器件对准耦合工艺与算法研究
Study on the Coupling Packaging Theory and the Key Techniques for Arrayed Waveguide Devices
阵列波导器件耦合封装机理及其关键技术研究, 2015, pp. 82-111 (USD 3.00)

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